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TE Connectivity AMP Connectors 5-103164-3 — Pin Headers, Sockets & Housings

TE 5-103164-3 AMPMODU Mod II Header 10-Pos

MPN5-103164-3
Active

TE Connectivity AMP Connectors AMPMODU Mod II header, order code 5-103164-3, 10 positions, dual row, 0.100" (2.54 mm) pitch, 3 A, gold-plated mating contacts, through-hole right-angle, solder termination.

$4.1500Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Aug 2026

Specifications

5-103164-3 key specifications
ParameterValue
SeriesAMPMODU Mod II
TypeMale Pin
MountingThrough Hole, Right Angle
Connector typeHeader
Fastening typeDetent Lock
Current rating3A
Operating temperature-65°C ~ 105°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.361\" (9.17mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0

All specifications

5-103164-3 additional specifications
ParameterValue
StyleBoard to Board or Cable
PackageTray
ShroudingShrouded - 3 Wall
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions10
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.125\" (3.18mm)
Contact finish - matingGold
Contact length - mating0.318\" (8.08mm)
Contact finish thickness - post100.0µin (2.54µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

10-position shrouded header, 2.54 mm pitch

The 5-103164-3 is the 10-position dual-row member of TE's AMPMODU Mod II header family, designed for board-to-board or cable-to-board interconnects. Gold mating contacts (30.0 µin) and a 3-wall shrouded housing with detent lock provide reliable mating in moderate-vibration environments.

Through-hole right-angle mounting, UL94 V-0

UL94 V-0 rated thermoplastic housing and phosphor bronze contacts with tin-plated posts (100.0 µin) complete the assembly.