TE Connectivity AMPMODU Mod II header, 5-103169-4, 12-position dual-row, 0.100-inch (2.54 mm) pitch, shrouded four-wall, through-hole solder termination, male pin, detent lock, gold-plated mating contact, 3 A rating.
| Parameter | Value |
|---|---|
| Series | AMPMODU Mod II |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Detent Lock |
| Current rating | 3A |
| Operating temperature | -65°C ~ 105°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.440\" (11.18mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board or Cable |
| Package | Tray |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 12 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.125\" (3.18mm) |
| Overall contact length | 0.533\" (13.55mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.318\" (8.08mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The row spacing is also 0.100 inches (2.54 mm), so the dual-row layout occupies a 0.200-inch-wide footprint on the board. The 0.100-inch pitch is a standard grid, making PCB layout straightforward with 0.025-inch-square pins.
This shrouded header mates with AMPMODU Mod II receptacles or IDC sockets that accept 0.025-inch-square pins on 0.100-inch centers. The detent lock engages with a matching latch on the receptacle housing.