Board Layout Fit: 0.100" Pitch, Dual-Row, Right-Angle
Current and Contact Duty: 3 A with Tin Plating
Tin plating is suitable for applications with infrequent mating cycles—typically under 50 cycles—where the wiping action maintains a low-resistance interface. The 100 µinch tin thickness on the post meets the common industrial standard for solder-joint reliability through wave or hand soldering.
