1.27 mm Pitch Dual-Row Header for Signal-Density Boards
The 5-103916-2: The tight pitch drives the board routing density — trace widths and clearances must be planned for this footprint, not a wider 2.54 mm grid. Rated 30 VAC, this header is suited for low-voltage signal paths, not power distribution. The voltage ceiling is a direct consequence of the narrow 1.27 mm pitch and unshrouded design.
Through-Hole Solder Termination and Unshrouded Profile
The header is unshrouded, which means the pins are exposed after soldering — no plastic wall around them. This saves board space and gives visual access for probing, but the pins are more vulnerable to accidental shorting during handling.
Operating Range and Material Compliance
Comparison to Peer 1-1871673-2
The 5-103916-2 offers 20 positions at a tighter 1.27 mm pitch with gold mating, making it the denser, higher-cycle option for vertical board-to-board or cable connections.