TE Connectivity AMPMODU 50/50 Grid header, 5-104655-3, 20 positions, 1.27 mm pitch, SMT, shrouded 4-wall, 30 µinch gold mating finish, board lock, 0.5 A per contact, 6.35 mm mated stack height.
| Parameter | Value |
|---|---|
| Series | AMPMODU 50/50 Grid |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 0.5A per Contact |
| Operating temperature | -65°C ~ 105°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.226\" (5.74mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Mated stacking heights | 6.35mm |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tube |
| Features | Board Lock |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | Automotive, General Purpose, Medical, Military, Telecommunications |
| Contact shape | Circular |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 20 |
| Row spacing - mating | 0.050\" (1.27mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact length - mating | 0.120\" (3.05mm) |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 5-104655-3: The 1.27 mm pitch and 1.27 mm row spacing set a dense footprint, while the 6.35 mm mated stack height defines the z-height budget between parallel PCBs. The tin-plated solder tails (150 µinch) are compatible with standard lead-free reflow profiles.
Surface-mount termination with a board lock: the SMT pads are soldered during reflow, while the board lock adds mechanical retention.
Yes, 5-104655-3 is ROHS3 compliant.
The 5-104655-3 mates with the matching AMPMODU 50/50 Grid receptacle from TE Connectivity. The receptacle is a separate part number — confirm the position count and contact finish match your application.
The mating pitch is 0.050" (1.27 mm), with the same row spacing of 0.050" (1.27 mm).