40-Position, 1.27mm Pitch Board-to-Board Header
The 5-104655-5: This is a 40-position, dual-row header on 1.27mm pitch — the board footprint matches a 40-pin mezzanine receptacle with the same 1.27mm row spacing. The 6.35mm mated stack height sets the board-to-board gap in the assembly.
Contact Ratings and Plating
The solder tail finish is 150 µinch tin, compatible with standard lead-free reflow profiles.
Operating Range and Applications
Listed applications include automotive, general purpose, medical, military, and telecommunications — a broad signal interconnect for board-to-board mezzanine stacks.
