The 5-104656-2: This is a dual-row, 20-position board-to-board header from TE's AMPMODU 50/50 Grid series. The 1.27mm pitch and 0.5A per contact rating place it firmly in the signal-density interconnect class — it's not a power header, but a compact signal path for dense PCB layouts.
Pitch, positions, and stack height — the footprint fit
The 1.27mm (0.050") pitch on both rows and the row-to-row spacing means the PCB footprint is a compact 2x10 grid. The 8.13mm mated stack height is a fixed value; the mating receptacle must match this height for proper contact compression.
Contact plating and current rating — what the numbers mean
At 0.5A per contact, the current is low enough that the gold layer's primary job is corrosion resistance and cycle life, not current-carrying capacity. The tin-plated solder tails (150 µinch) are standard for SMT soldering. The 0.5A rating is per contact at the stated operating temperature range.