Board-to-Board Stacking with 1.27mm Pitch
The 5-104656-5: This 50-position, dual-row header from the AMPMODU 50/50 Grid series mates at a stacking height of 8.13 mm, with a 1.27 mm pitch on both row and column spacing. The 0.050" (1.27 mm) grid gives you dense board-to-board routing — useful when you need to squeeze 50 signals into a tight mezzanine gap without going to a flex circuit.
The solder tails are tin-plated (150.0 µin) for good solderability with standard SAC reflow profiles.
Why the 1318699-3 Is Not a Swap
The 50-position 1.27 mm grid of this part serves a completely different footprint and current class.