70-position 1.27 mm board-to-board header
The 5-104656-7 is the 70-circuit member of TE's AMPMODU 50/50 Grid header line, a dual-row board-to-board interconnect on a 1.27 mm pitch.
Stack height and footprint
The 70-position header mates to a stacking height of 8.13 mm. The dual-row layout uses a 1.27 mm row-to-row spacing, matching the mating pitch — the footprint is a 2 × 35 grid of 1.27 mm × 1.27 mm pads.
