TE Connectivity AMPMODU 50/50 Grid header, order code 5-104656-8, 80 positions, dual row, 1.27 mm pitch, 0.5 A per contact, gold-plated mating contacts, surface-mount, solder termination, shrouded - 4 wall.
| Parameter | Value |
|---|---|
| Series | AMPMODU 50/50 Grid |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 0.5A per Contact |
| Operating temperature | -65°C ~ 105°C |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.298\" (7.57mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Mated stacking heights | 8.13mm |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tube |
| Features | Board Lock |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | Automotive, General Purpose, Medical, Military, Telecommunications |
| Contact shape | Circular |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 80 |
| Row spacing - mating | 0.050\" (1.27mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact length - mating | 0.120\" (3.05mm) |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 5-104656-8 is the 80-position member of TE Connectivity's AMPMODU 50/50 Grid header line, a dual-row board-to-board interconnect on a 1.27 mm pitch.
The 5-104656-8 mates to a mated stack height of 8.13 mm, with a row-to-row spacing of 1.27 mm matching the mating pitch — the board footprint and keep-out zone are uniform across the AMPMODU 50/50 Grid series.
The mated stack height is 8.13 mm.
RoHS and REACH documentation is available from the manufacturer upon request.