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TE Connectivity AMP Connectors 5-104693-2 — Pin Headers

5-104693-2 TE AMPMODU 50/50 Grid Header 20 Pos 1.27mm SMT

MPN5-104693-2
Active

TE Connectivity AMPMODU 50/50 Grid header, 5-104693-2, 20 positions, 2 rows, 1.27 mm pitch, SMT, shrouded 4-wall, gold mating finish, board lock, UL94 V-0, -65°C to 105°C

$6.2300Ref. price · indicative, final on quote
RoHSROHS3 Compliant
SeriesAMPMODU 50/50 Grid
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Aug 2026

Specifications

5-104693-2 key specifications
ParameterValue
SeriesAMPMODU 50/50 Grid
TypeMale Pin
MountingSurface Mount
Connector typeHeader
Fastening typePush-Pull
Current rating0.5A per Contact
Operating temperature-65°C ~ 105°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.367\" (9.33mm)
Insulation materialLiquid Crystal Polymer (LCP)
Mated stacking heights9.91mm

All specifications

5-104693-2 additional specifications
ParameterValue
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageTube
FeaturesBoard Lock
ShroudingShrouded - 4 Wall
TerminationSolder
ApplicationsAutomotive, General Purpose, Medical, Military, Telecommunications
Contact shapeCircular
Rows2
Pitch0.050\" (1.27mm)
Positions20
Row spacing - mating0.050\" (1.27mm)
Contact finish - postTin
Contact finish - matingGold
Contact length - mating0.120\" (3.05mm)
Contact finish thickness - post150.0µin (3.81µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

Why this 1.27 mm pitch header exists

The 5-104693-2 is a 20-position, 2-row board-to-board header from the AMPMODU 50/50 Grid series. Its 1.27 mm pitch and 0.5 A per contact rating target dense signal interconnects where a standard 2.54 mm pitch would waste board real estate. Mated stack height is fixed at 9.91 mm, which sets the board-to-board spacing for mezzanine or parallel-board layouts.

Board lock and SMT termination for reflow assembly

Board locks on the SMT package anchor the header during reflow, preventing skew from paste wetting forces. After soldering, the locks resist shear loads from cable strain or vibration — relevant for the automotive and military applications listed for this part.

RoHS3 compliant per the ledger entry. No known functional replacement from TE Connectivity — the 5-104693-2 is the current offering in this pitch and position count.

The 5-104693-2 is a 20-position, 2-row, SMT header at 1.27 mm pitch, rated 0.5 A per contact — two different density and power classes. They are not cross-shop candidates; the selection depends on board space and current budget.

Frequently asked questions

Can 5-104693-2 replace 1318699-3?

No. The 1318699-3 is a 12-position, 4-row, through-hole header at 4.20 mm pitch rated 5 A. The 5-104693-2 is a 20-position, 2-row, SMT header at 1.27 mm pitch rated 0.5 A. They serve different board density and current requirements.