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TE Connectivity AMP Connectors 5-104693-4 — Pin Headers

5-104693-4 Header 40POS 1.27mm SMT TE AMPMODU

MPN5-104693-4
Active

TE Connectivity AMPMODU 50/50 Grid header, 5-104693-4, 40-position dual-row, 0.050-inch (1.27 mm) pitch, surface-mount, shrouded 4-wall, gold mating finish, board lock, UL94 V-0 LCP housing.

$8.7700Ref. price · indicative, final on quote
RoHSROHS3 Compliant
SeriesAMPMODU 50/50 Grid
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

5-104693-4 key specifications
ParameterValue
SeriesAMPMODU 50/50 Grid
TypeMale Pin
MountingSurface Mount
Connector typeHeader
Fastening typePush-Pull
Current rating0.5A per Contact
Operating temperature-65°C ~ 105°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.367\" (9.33mm)
Insulation materialLiquid Crystal Polymer (LCP)
Mated stacking heights9.91mm

All specifications

5-104693-4 additional specifications
ParameterValue
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageTube
FeaturesBoard Lock
ShroudingShrouded - 4 Wall
TerminationSolder
ApplicationsAutomotive, General Purpose, Medical, Military, Telecommunications
Contact shapeCircular
Rows2
Pitch0.050\" (1.27mm)
Positions40
Row spacing - mating0.050\" (1.27mm)
Contact finish - postTin
Contact finish - matingGold
Contact length - mating0.120\" (3.05mm)
Contact finish thickness - post150.0µin (3.81µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

What this 40-position SMT header does in a board stack

The 5-104693-4: The shrouded 4-wall housing with push-pull fastening protects the male pins from damage during blind mating and prevents misalignment in a multi-connector panel layout.

Frequently asked questions

Can the 5-104693-4 be used for automotive applications?

Yes, automotive is listed among the intended applications, alongside general purpose, medical, military, and telecommunications.