Board-to-board header with 70 positions at 1.27mm pitch
The 5-104693-7: This is a 70-position, dual-row header from the AMPMODU 50/50 Grid series, designed for board-to-board stacking. The 1.27mm pitch and 1.27mm row spacing keep the footprint compact while the 9.91mm mated stack height sets the board separation. A board lock on each end holds the header flat during reflow and resists shear from the cable strain on the mating half.
SMT termination with gold mating interface
The solder posts are tin-plated at 150.0µin, compatible with standard SAC reflow profiles. The header is surface-mount only; no through-hole option in this order code.
