80-Pin, 1.27 mm Pitch — Board Layout Fit
The 5-104693-8: This 80-position, dual-row header on a 0.050 inch (1.27 mm) mating pitch is a dense board-to-board interconnect for mezzanine stacking, backplane, or module-to-motherboard applications. The mated stacking height of 9.91 mm gives a fixed z-height budget for the board pair, and the board lock feature anchors the header during reflow and resists shear from cable strain or thermal cycling.
Signal-Level Current, Gold Mating Surface
Rated at 0.5 A per contact, this header is strictly for signal paths — not power distribution. The gold mating finish (30.0 µin / 0.76 µm) on phosphor bronze contacts supports repeated mating cycles with low contact resistance, while the tin-plated posts (150.0 µin / 3.81 µm) handle the solder joint reliably. The 0.5 A rating per contact is consistent with the fine pitch — the narrow spacing limits current more than the contact itself. For a power interconnect in the same series, look to a wider-pitch sibling like 1318699-3 (4.20 mm pitch, 5 A per contact, through-hole, latch lock) — but that part is a board-to-cable/wire style, not a direct footprint swap.
Mates with a 1.27 mm pitch, dual-row, surface-mount AMPMODU 50/50 Grid receptacle (search the 104693 base number for compatible receptacles). Termination is solder; the SMT footprint requires a reflow profile compatible with the LCP housing (UL94 V-0).