1.27 mm Pitch, 20-Position Right-Angle SMT Header
The 5-104894-2: The 1.27 mm pitch and 1.27 mm row spacing set a dense footprint that suits compact PCB layouts where routing channels are tight.

TE Connectivity AMPMODU 50/50 Grid header, 5-104894-2, 20 positions, 1.27 mm pitch, right-angle surface mount, shrouded 4-wall, gold mating contacts, 0.5 A per contact, UL94 V-0 LCP housing, board lock, -65°C to 105°C.
| Parameter | Value |
|---|---|
| Series | AMPMODU 50/50 Grid |
| Type | Male Pin |
| Mounting | Surface Mount, Right Angle |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 0.5A per Contact |
| Operating temperature | -65°C~105°C |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.213\" (5.40mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Tube |
| Features | Board Lock, Solder Retention |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | Automotive, General Purpose, Medical, Military, Telecommunications |
| Contact shape | Circular |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 20 |
| Row spacing - mating | 0.050\" (1.27mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 5-104894-2: The 1.27 mm pitch and 1.27 mm row spacing set a dense footprint that suits compact PCB layouts where routing channels are tight.
The 5-104894-2 has a 1.27 mm (0.050 inch) mating pitch, dual rows with 1.27 mm row spacing, and 20 positions fully loaded.
Availability and current pricing confirmed at quote time — submit an RFQ for this exact order code.