Board-to-board header for dense parallel stacking
The 5-104894-5 is a 50-position, dual-row header from the AMPMODU 50/50 Grid series, designed for board-to-board interconnects where the 0.050" (1.27 mm) pitch drives the PCB routing density and the mating receptacle footprint. The surface-mount, right-angle orientation places the connector at the board edge, with the mated receptacle running parallel to the PCB — a common configuration for mezzanine or card-edge stacking where z-height is constrained.
The post (solder tail) finish is 150 µinch tin, which provides a reliable solder joint with standard SAC305 or SnPb reflow profiles.
