Board lock and solder retention
The 5-104895-4: Integral board lock and solder retention features hold the SMT right-angle header to the PCB during reflow and resist shear forces from cable strain.
TE 5-104895-4 Header, 40 Pos, 1.27mm Pitch, SMT Right Angle
MPN5-104895-4
Active
TE Connectivity AMPMODU 50/50 Grid header, order code 5-104895-4, 40 positions, dual row, 1.27 mm pitch, 0.5 A per contact, gold-plated mating contacts, surface-mount right-angle, solder termination.
$6.7374Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Aug 2026
Specifications
| Parameter | Value |
|---|---|
| Series | AMPMODU 50/50 Grid |
| Type | Male Pin |
| Mounting | Surface Mount, Right Angle |
| Connector type | Header |
| Fastening type | Latch Holder |
| Current rating | 0.5A per Contact |
| Operating temperature | -65°C ~ 105°C |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.213\" (5.40mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Material flammability rating | UL94 V-0 |
All specifications
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Tube |
| Features | Board Lock, Solder Retention |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | Automotive, General Purpose, Medical, Military, Telecommunications |
| Contact shape | Circular |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 40 |
| Row spacing - mating | 0.050\" (1.27mm) |
| Contact finish - post | Tin-Lead |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |