TE Connectivity AMPMODU Mod II, 8-position unshrouded breakaway header, 0.100" (2.54 mm) pitch, SMT, gold mating finish, 3 A, UL94 V-0
| Parameter | Value |
|---|---|
| Series | AMPMODU Mod II |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Voltage rating | 30VAC |
| Current rating | 3A |
| Operating temperature | -65°C ~ 125°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.090\" (2.29mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Board or Cable |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 8 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact length - mating | 0.320\" (8.13mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Compared to a 10-position version (same pitch, same plating), this 8-position header uses the same dual-row layout but with two fewer circuits per row. The footprint is shorter, which matters when board-edge real estate is tight or the mating receptacle is a fixed-width IDC socket that must align exactly.
The row spacing is also 0.100".
Yes — the style is listed as Board to Board or Cable. The unshrouded header mates with AMPMODU Mod II receptacles or IDC sockets for wire-to-board or board-to-board links.