TE Connectivity AMPMODU Mod II, 5-146259-6, 12-position unshrouded breakaway header, 0.100" (2.54 mm) pitch, dual-row, through-hole solder termination, gold-plated mating contacts, rated 3 A, UL94 V-0 LCP housing.
| Parameter | Value |
|---|---|
| Series | AMPMODU Mod II |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.090\" (2.29mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board or Cable |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 12 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.090\" (2.29mm) |
| Overall contact length | 0.410\" (10.41mm) |
| Contact finish - mating | Gold |
| Contact length - mating | 0.230\" (5.84mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 5.00µin (0.127µm) |
The gold-over-nickel finish supports 50-100 mating cycles in clean, indoor environments — adequate for board-to-board or cable-to-board connections that are mated during assembly and rarely cycled in the field. The 100 µinch tin post finish ensures good solderability through the wave or hand-solder process.
The 5-146259-6 mates with AMPMODU Mod II receptacles, IDC sockets, or crimp housings designed for 0.025" square pins on 0.100" (2.54 mm) centers. The mating half must be unshrouded or have a compatible pin cavity — no polarization keying is provided by the header itself.