Board-fit note for a 2-position breakaway
The 0.100" (2.54mm) pitch and through-hole solder termination match the standard 0.100" grid footprint common on prototyping and production boards.
Contact finish and current capacity
The mating surface carries 15.0 µin (0.38 µm) of gold over the copper alloy base, which handles repeated mate/unmate cycles without the oxide build-up that tin contacts develop. The post (solder tail) is tin-plated at 100.0 µin (2.54 µm) for reliable solder wetting.
