Board footprint and pitch for layout
The 5-147279-9: Dual-row spacing is also 0.100", giving a compact 8x2 footprint that fits many signal I/O and data bus applications. With 16 positions all loaded, this header provides a full complement of signal or power contacts in a single SMT package.
Plating grade and mating cycle life
Tin-plated solder tails (100 µinch) ensure reliable solder joint formation during reflow.
SMT termination and automated assembly
The unshrouded profile and 0.090" (2.29 mm) insulation height keep the component low-profile for tight board stacks.
