DIP Socket Footprint and Pin Grid
The 5-1571551-0: This is a 32-position DIP socket arranged as a 2 x 16 grid with 0.600" (15.24mm) row spacing and 0.100" (2.54mm) pitch between adjacent pins — the standard footprint for 32-pin DIP ICs with 0.6" body width. The closed-frame design surrounds the contact area, providing mechanical protection and preventing solder wicking during wave-solder assembly.
Contact Interface and Plating Grade
Both the mating and post contacts carry 25.0µin (0.63µm) gold over nickel — the gold-on-gold interface keeps contact resistance at 10mOhm and supports repeated insertion/withdrawal cycles without oxidation buildup. The mating contact is beryllium copper, chosen for its spring properties and fatigue resistance over the rated temperature range.