100-Position Mezzanine Receptacle at 0.80mm Pitch
The 0.80mm pitch and dual-row layout pack a high signal count into a compact footprint, typical for mid-plane or mezzanine interconnects in telecom and server equipment where routing density matters more than per-contact current.
The 17mm mated stacking height is the single dimension that governs the board-to-board spacing — the receptacle sits at 15.75mm above the PCB, so the mating plug height must make up the remaining 1.25mm. The 0.80mm pitch leaves 0.50mm between adjacent pad centres after accounting for typical pad diameter, which forces a fine-line PCB process for the breakout traces. The board guide on the receptacle helps align the two halves during assembly, taking shear off the signal contacts.
Contact Plating and Signal Duty
The outer shroud contacts shield the signal pins during mating and provide a low-impedance return path. Surface-mount termination keeps the board-side profile low, though the 100-position count demands careful solder-paste stencil design to avoid bridging.