Board-to-Board Mezzanine Interconnect, 60 Circuits at 0.80 mm Pitch
The 13 mm Stack Height and Board Guide in Practice
The 0.463" (11.75 mm) height above board means the receptacle body sits nearly flush with the top of the 13 mm stack — the mating header takes the remaining 1.25 mm. That tight z-budget is typical for mezzanine card spacing where every tenth-millimetre matters. The board guide feature is not cosmetic: it captures the mating header's alignment posts before the contacts engage, preventing bent pins in blind assembly or vibration. For a 60-position dual-row connector at 0.80 mm pitch, that alignment is what keeps the outer rows from skiving during mate.
Surface Mount Termination and Gold Plating
The SMT termination suits reflow assembly, and the 8.00 µ" gold on the contact interface is a standard mezzanine-grade plating — enough for the moderate mating cycle counts typical of card-edge and module interconnects. The gold thickness is specified on the mating surface only; the solder tail is likely tin-plated for reliable wetting. Tube packaging keeps the parts aligned for pick-and-place without tape peel issues.