The 0.118" row spacing mirrors the pitch, so the footprint is a clean 3.00 mm grid — the board layout engineer gets a predictable via pattern and a 7.37 mm insulation height that clears most low-profile components on the back side.
ROHS3 compliant, housing is UL94 V-0 rated polyamide (nylon).
What the tin plating and board lock mean for the build
100.0 µinch tin on the mating face — this is a thick tin layer, not a flash. It withstands repeated mating cycles in a production harness assembly environment without galling, but tin-to-tin contacts are not rated for the cycle life of gold. They lock the header in position before the solder solidifies, preventing skew from cable strain during assembly. Without them, the right-angle body would lever under wire pull and stress the solder joints.