Board-to-board or cable header, 24 positions
The 5-87589-8 is the 24-position member of TE Connectivity's AMPMODU Mod II shrouded header line, designed for board-to-board or cable interconnect. Dual-row layout at 0.100" (2.54mm) pitch, rated 3 A per contact with tin-plated mating surfaces, through-hole solder termination, and a detent lock for retention.
Pitch, plating, and temperature range
The 0.100" (2.54mm) pitch and row spacing match the standard AMPMODU Mod II footprint — the 24 positions are fully loaded across two rows. Tin-on-tin contact interface with 100.0µin (2.54µm) thickness on both mating and post sides; UL94 V-0 glass-filled nylon housing rated for -65°C to 105°C.