34-position, 0.100-inch pitch — signal-density header for board-to-cable
The 5102322-8 is a 34-position, dual-row header from TE's AMP-Latch series, designed for board-to-cable/wire interconnect. At 1 A per contact, this header handles signal-level loads; the current ceiling is set by the pitch and contact geometry, not the gold plating. The right-angle through-hole termination routes the cable parallel to the board, saving z-height in card-cage or panel-mount assemblies where the connector sits at the board edge. The shrouded 4-wall housing protects the male pins during handling and guides the mating receptacle into alignment.
30 µinch gold mating face — rated for repeated reconnection
In a field-service application where the connector is cycled quarterly, that is decades of service life at the contact interface. The solder tails are tin-plated (100.0 µinch / 2.54 µm) for reliable soldering to the PCB. The keying slot prevents mis-mating with non-keyed receptacles, a common source of field scrap.