10-position, 0.100" pitch, right-angle — what it fits
Rated 1A per contact with a gold or gold-palladium mating finish at 15.0µinch thickness — enough for signal-level circuits in repeated-mate applications. The tin-plated solder posts (100.0µinch) wet reliably through wave solder.
Mates with AMP-Latch IDC receptacles
This header is the board-side half of the AMP-Latch system. It mates with TE's AMP-Latch IDC socket connectors on 0.100" pitch, 10-position, dual-row. In vibration-prone environments, the four-wall shroud and the friction of the IDC contact beam provide the retention.
RoHS Compliant per TE's current compliance declaration.
How it compares to 1379030-3
The 1379030-3 uses tin mating finish (not gold) and a copper alloy contact material. If your application needs the extra two circuits and a locking latch, that part is the alternative; if gold plating for repeated mating cycles is required, stay with 5103310-1.