Board-to-wire header with keying slot
The 5111008-8: It carries 1 A per contact across a dual-row 0.100" pitch, with a gold or gold-palladium mating finish and a 30.0µin thickness for repeated mating cycles.
TE AMP-Latch 5111008-8 Header, 34 Pos, 0.100" Pitch
MPN5111008-8
Active
TE Connectivity AMP-Latch header, order code 5111008-8, 34 positions, dual row, 0.100" (2.54 mm) pitch, 1 A per contact, shrouded - 4 wall, through hole, solder termination, gold or gold-palladium mating contact finish.
$8.5967Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
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Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Aug 2026
Specifications
| Parameter | Value |
|---|---|
| Series | AMP-Latch |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Current rating | 1A per Contact |
| Operating temperature | -65°C ~ 105°C |
| Insulation color | Red |
| Insulation height | 0.549\" (13.94mm) |
| Insulation material | Polycyclohexylenedimethylene Terephthalate (PCT) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
All specifications
| Parameter | Value |
|---|---|
| Package | Bulk |
| Features | Keying Slot, Mounting Flange |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 34 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.110\" (2.79mm) |
| Overall contact length | 0.639\" (16.23mm) |
| Contact finish - mating | Gold or Gold-Palladium |
| Contact length - mating | 0.240\" (6.10mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Product details
Frequently asked questions
What compliance documentation is available for the 5111008-8?
RoHS and REACH documentation is available from TE Connectivity upon request.