TE Connectivity AMP Connectors Series 500, 516-AG10D, 16-position DIP socket, 0.100" (2.54mm) pitch, 0.3" (7.62mm) row spacing, gold-plated beryllium copper contacts, through-hole solder termination, closed frame, tube package.
| Parameter | Value |
|---|---|
| Type | DIP, 0.3\" (7.62mm) Row Spacing |
| Series | 500 |
| Mounting | Through Hole |
| Operating temperature | -55°C~125°C |
| Contact material - post | Brass |
| Contact material - mating | Beryllium Copper |
| Package | Tube |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - post | 0.100\" (2.54mm) |
| Pitch | 0.100\" (2.54mm) |
| Contact resistance | 10mOhm |
| Contact finish - mating | Gold |
| Termination post length | 0.125\" (3.18mm) |
| Number of positions or pins | 16 (2 x 8) |
The 516-AG10D: It accepts standard DIP ICs and mates with 0.100" pitch round or square pins. The closed-frame design shields the contacts from solder splash during wave soldering. Contact resistance is rated at 10 mOhm, typical for a machined-contact DIP socket.
For BOM positions that require this exact footprint and contact material, the only supply path is through independent distribution surplus or overstock lots.
A pin-compatible alternative would need to match the 16-position 2x8 grid, 0.100" pitch, 0.3" row spacing, gold-plated beryllium copper contacts, and closed-frame DIP socket form factor. Verify the BOM footprint and contact material requirements before substituting.