Z-PACK Futurebus Header, Press-Fit, 30 Circuits
The TE Connectivity 5223016-1 is a 30-position header from the Z-PACK series, designed for Futurebus backplane architectures. Rated for 30 V — a signal-level voltage that confirms this header sits in a logic or data path, not a power distribution rail.
Press-Fit Termination and Board Layout
The press-fit tail is designed for a through-hole PCB. No solder means no thermal stress on the housing or the board during assembly, and the compliant pin holds position in the plated through-hole with a gas-tight interface. For the board layout engineer, the 2.00 mm pitch across five rows demands a tight routing channel — expect to run traces between the outer rows on inner layers, with via-in-pad only if the stack-up allows.