Futurebus Backplane Receptacle — 30 Position, 5-Row Press-Fit
The TE Connectivity 5223652-1 is a 30-position Z-PACK receptacle in the Futurebus connector style, designed as the board-side half of a high-density backplane interconnect. It carries five rows of female sockets on a 0.079" (2.00mm) pitch, which means the board footprint packs 30 signal contacts into a compact column — typical for mid-plane and backplane cards where routing density matters more than per-contact current. The press-fit termination eliminates soldering, so the connector can be pressed into plated through-holes on a backplane panel without a wave or reflow step, and individual contacts can be replaced in rework without desoldering the whole connector.
The through-hole mounting requires the backplane to have the correct plated-through-hole diameter for the compliant pin — typically specified in the TE application tooling documentation for the Z-PACK series. No specific press-fit tool is mandated by the listing, but a standard arbor press with a flat anvil and a support fixture under the board is the usual approach for this pin geometry.
The 5-row, 30-position arrangement is specific to the Futurebus form factor — the header carries the male pins that insert into these sockets. The mating interface is keyed by the Futurebus shell geometry, so a header from a different backplane standard (like 2mm HM or Z-PACK HM) will not fit. For a backplane system, the header is typically mounted on the daughter card, and this receptacle is pressed into the backplane.