The TE Connectivity 5536501-1 is a 24-position, 4-row header from the Z-PACK series, built to the Futurebus+ standard for high-density backplane interconnects. The 0.079" (2.00 mm) pitch packs 24 circuits into a compact footprint, routing dense signal traces through a single board interface.
The 2.00 mm pitch is tighter than the legacy 0.100" (2.54 mm) backplane pitch, so the board footprint needs a correspondingly finer trace-and-space capability — verify your PCB fabricator can route between the via pads.