96-Position Futurebus Backplane Receptacle — 2.00 mm Pitch, 4 Rows
The TE Connectivity 5536507-3 is a 96-position Z-PACK receptacle built to the Futurebus connector standard, designed for high-density backplane card-edge interconnects. All 96 positions are loaded across 4 rows at a 0.079" (2.00mm) pitch — the tightest spacing in this form factor, which drives the board routing density and footprint for the mating header. Gold contact finish supports repeated card insertion and extraction in field-serviceable chassis. The right-angle, through-hole mounting orients the connector perpendicular to the PCB plane, matching the card-edge insertion axis of a standard backplane slot.
What the 30 V Rating and Temperature Range Mean for Your Design
The 30 V voltage rating confirms this is a signal-level interconnect — it carries logic-level differential pairs or single-ended busses, not power rails. Board Guide and Spacer features help align the receptacle during press-fit or solder assembly and maintain consistent standoff from the backplane.