Futurebus Backplane Header — 24 Positions, 2.00 mm Pitch
The TE Connectivity 5536513-1 is a Z-PACK series Futurebus-style header with 24 male pins arranged in 4 rows on a 0.079" (2.00 mm) pitch. It's a through-hole solder termination header designed for backplane board-to-board interconnect in high-density telecom, datacom, and industrial computing systems. The UL94 V-0 rated housing meets the flame retardance requirement for equipment installed inside enclosures.
Positioning in the Z-PACK Series
Within the Z-PACK Futurebus family, this 24-position, 4-row header is a mid-density option. Compared to the 2-1437357-0, which carries a 28 A current rating in a spool-packaged variant, the 5536513-1 is clearly a signal-level interconnect — the 30 V rating and gold contacts confirm it's not intended for bus-level power distribution. If your BOM calls for a power-capable Z-PACK variant, the 2-1437357-0 is the higher-current sibling to evaluate.