TE Connectivity Z-PACK Futurebus header, 5536623-1, 8 positions (all loaded), 4 rows, 0.236" (6.00 mm) pitch, through-hole solder termination, gold flash contacts, UL94 V-0, natural.
| Parameter | Value |
|---|---|
| Series | Z-PACK |
| Mounting | Through Hole |
| Connector type | Header, Male Blades |
| Voltage rating | 30V |
| Operating temperature | -55°C ~ 125°C |
| Color | Natural |
| Material flammability rating | UL94 V-0 |
| Pitch | 0.236\" (6.00mm) |
| Package | Tube |
| Features | Board Guide |
| Termination | Solder |
| Contact finish | Gold |
| Rows | 4 |
| Positions | 8 |
| Contact layout, typical | 8 Power |
| Contact finish thickness | Flash |
It is a through-hole, solder-terminated board-to-backplane interconnect designed for power distribution — the contact layout is 8 power positions, all loaded. The 6.00 mm pitch provides generous creepage for the 30 V rating and keeps the board footprint straightforward for power routing. The housing is natural, rated UL94 V-0, and includes a board guide to align the header during backplane insertion.
The contacts are gold flash. Flash thickness is suitable for a single mate during assembly.
Yes, the 5536623-1 is ROHS3 Compliant.
The pitch is 0.236" (6.00 mm).