Board-to-Board Signal Interconnect at 0.025" Pitch
The TE Connectivity 5767056-1 is a 38-position MICTOR series plug with outer shroud contacts, designed for high-density board-to-board signal interconnect. Two rows of contacts give 38 signal paths in a narrow body, with a height above board of 0.251" (6.38mm). The connector mates to a matching MICTOR receptacle at one of two documented stack heights: 6.6mm or 15.62mm, covering both low-profile mezzanine and taller parallel-board spans. The palladium-nickel contact finish at 5.00µin (0.127µm) is a hard, low-wear surface — this is a signal-path finish for repeated mating cycles, not a power-contact finish. The built-in board guide eases alignment during assembly in dense mezzanine stacks, and the ground bus (plane) provides a low-inductance return path critical for maintaining signal integrity at high edge rates.
Mating and Stack Height Planning
The mated stack heights are specified at 6.6mm and 15.62mm — two distinct z-height targets that let the designer choose between a low-profile mezzanine connection or a taller board span.
Why the Contact Finish Matters
Palladium-nickel at 5.00µin is a common choice for high-reliability signal connectors that see repeated mate/unmate cycles in test equipment or field-serviceable assemblies. It is harder than gold at equivalent thickness and resists adhesive wear, but it is not a high-current finish — the 0.025" pitch and thin plating together mean this connector is sized for signal-level currents, not power distribution. The ground bus plane complements the signal path by providing a low-inductance reference, which matters for differential pairs or high-speed single-ended lines where return current crowding at the edge of the connector can degrade signal quality.