68-Position Shielded D-Sub for High-Density Backplane Signal Interconnects
The TE Connectivity 5786155-7 is a 68-position D-sub receptacle from the AMPLIMITE.050 III series, designed for vertical press-fit mounting through a PCB. It carries gold-plated phosphor bronze signal contacts rated 1 A each, with the 0.050 inch pitch and 0.100 inch row-to-row spacing defining the board footprint for high-density signal routing. The steel shell is nickel-plated and the housing is shielded, giving the interconnect EMI containment suitable for telecom and industrial backplane environments where signal integrity matters.
Press-Fit Termination and Board Assembly Fit
The press-fit termination eliminates soldering, which is a key advantage for backplane assemblies where rework access is limited and solder-joint inspection is impractical. The compliant press-fit pin deforms elastically into the plated through-hole, creating a gas-tight connection that survives thermal cycling. The flange features include housing/shell threaded inserts (2-56) and latchblocks for secure mating with the corresponding plug — the latchblocks provide a secondary lock against vibration-induced disconnection in rack-mounted equipment. The through-hole mounting orientation places the receptacle vertically on the board, with the shell and latchblocks providing the mechanical retention that the press-fit pins alone should not be asked to carry.
Positioning Within the AMPLIMITE .050 III Series
At 68 positions, this receptacle sits at the high-density end of the AMPLIMITE.050 III series, which also offers lower position counts such as the 50-position variant (5786155-1). The 0.050 inch pitch is common across the series, so the footprint geometry scales with position count — a 68-position layout simply extends the row length compared to a 50-position board pattern. The press-fit termination and shielded shell are shared across the series; the decision between position counts is driven by the number of signal lines the backplane needs to route.