Skip to main content
TE Connectivity AMP Connectors 5822030-3 — Pin Headers, Sockets & Housings

5822030-3 TE Connectivity Micro-Edge 72-Position SIMM Socket

MPN5822030-3
Active

TE Connectivity AMP Connectors Micro-Edge series, 72-position SIMM socket, through-hole mount, accepts 0.047"–0.054" card thickness, 200 µinch tin contacts, board guide and latches, ROHS3 compliant

$7.8200Ref. price · indicative, final on quote
RoHSROHS3 Compliant
SeriesMicro-Edge
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Aug 2026

Specifications

5822030-3 specifications
ParameterValue
SeriesMicro-Edge
Memory typeRAM
MountingThrough Hole
Mounting featureNormal, Standard - Top
Connector typeSIMM
StandardsMO-116
PackageTube
FeaturesBoard Guide, Latches
Card thickness0.047\" ~ 0.054\" (1.19mm ~ 1.37mm)
Contact finishTin
Positions72
Contact finish thickness200.0µin (5.08µm)

Product details

SIMM socket for 72-position memory modules

The 5822030-3 is a 72-position SIMM socket from TE Connectivity's Micro-Edge series, designed to accept standard 72-pin SIMM memory modules. It mounts through-hole on the PCB with a normal, top-loading orientation and includes a board guide and latches for module retention. The card slot accepts PCB edge thickness from 0.047" to 0.054" (1.19mm to 1.37mm), which covers the standard SIMM module edge thickness. The 200 µinch (5.08µm) tin contact finish is appropriate for low mating-cycle applications typical of installed memory — tin is cost-effective but does not match the durability of gold for frequent module swaps.

Board layout and mounting check

Through-hole mounting with a normal, standard-top orientation means the socket sits perpendicular to the board, and the SIMM module inserts at an angle and then latches down. The board guide and latches provide mechanical alignment and retention — no additional hardware is needed for module hold-down in most applications. The socket conforms to the MO-116 standard outline, which defines the footprint and keep-out zone for 72-position SIMM sockets. Verify the PCB layout matches the MO-116 pad pattern before committing the BOM.

Frequently asked questions

Where can I buy 5822030-3 and how do I get a price?

The 5822030-3 is active and orderable. We source it through independent distribution — submit an RFQ with your target quantity, and we will confirm availability and current pricing at quote time. No stock-holding claim is made; each order is sourced per your BOM.

Is 5822030-3 RoHS compliant?

Yes, it is ROHS3 compliant.