The 6-102567-3 is a 30-position, dual-row, through-hole header from the TE Connectivity AMPMODU Mod II series. The tin-plated solder tails (100.0 µinch) provide a reliable solder joint in standard wave-solder processes.
Current rating and thermal limits
In practice, derate the current if the ambient temperature exceeds 85°C, following the standard derating curve for AMPMODU Mod II headers.
Peer comparison: 1376779-2 vs 6-102567-3
The closest functional peer within the AMPMODU Mod II family is 1376779-2. Both are 30-position, dual-row, through-hole headers with the same 0.100" pitch, 3 A rating, and 250 VAC voltage. The key difference is the mating gold thickness: 6-102567-3 carries 15.0 µinch gold, while 1376779-2 uses 8.00 µinch gold. For applications requiring more than 200 mating cycles, the thicker gold on 6-102567-3 is the better choice.