The 6-103916-6: The 1.27 mm pitch (0.050 in) and 80 positions in two rows at 0.100 in row spacing define a dense but routable footprint. At this pitch, a single trace between pads is feasible on a standard 1 oz copper layer, but the board layout engineer should budget for a via fan-out on inner rows if the signal count exceeds the outer row capacity.
Mating and termination — unshrouded header, push-pull fastening
Unshrouded header with push-pull fastening — mates with AMPMODU System 50 receptacles or compatible 1.27 mm pitch IDC sockets. The 0.125 in mating pin length provides sufficient wipe for a reliable contact interface. Through-hole solder termination with 0.100 in post length — the board hole pattern and solder fillet are standard for 1.27 mm pitch headers. The tin-plated post (150 µinch) is compatible with lead-free wave or hand-solder processes.