26-Position Right-Angle Header at 1.27 mm Pitch
The 6-104069-3: All 26 positions are loaded with male pin contacts, so there are no unpopulated pins to manage on the BOM or the layout.
Gold Mating Interface for Repeated Connect Cycles
Mating contacts are plated with 30 µinch gold over copper alloy. The tin post mates well with the solder fillet on the PCB pad without requiring a separate flux or plating step.
Board Layout and Mounting Dimensions
The 0.050" pitch between adjacent pins in the same row is the tighter dimension that drives routing density. A board guide feature is integrated into the housing — this helps align the header during placement on the PCB before soldering, reducing skew that could cause pin-to-hole misalignment.
The header is rated for 30 VAC — this is a signal-level voltage, not a power bus. The AMPMODU System 50 series is designed for dense signal interconnect, not high-current distribution.