TE Connectivity AMPMODU 50/50 Grid receptacle, 100 positions, dual-row, 0.050-inch pitch, surface-mount, gold-plated mating contacts, board lock, tube package.
| Parameter | Value |
|---|---|
| Series | AMPMODU 50/50 Grid |
| Type | Female Socket |
| Mounting | Surface Mount |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Operating temperature | -65°C ~ 105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.187\" (4.75mm) |
| Insulation material | Liquid Crystal Polymer (LCP) |
| Mated stacking heights | 6.35mm, 8.13mm, 9.91mm |
| Style | Board to Board or Cable |
| Parameter | Value |
|---|---|
| Package | Tube |
| Features | Board Lock |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.050\" (1.27mm) |
| Positions | 100 |
| Row spacing - mating | 0.050\" (1.27mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 150.0µin (3.81µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 0.050-inch pitch sets a tight trace/space budget on the PCB, while the dual-row layout keeps the connector footprint compact for high-circuit-count mezzanine or parallel-board interconnects. Three mated stacking heights are supported — 6.35 mm, 8.13 mm, and 9.91 mm — allowing the same receptacle to match different board spacings in mezzanine designs without changing the PCB footprint.
Yes, the 6-104652-0 includes a board lock feature that anchors the connector during SMT reflow and provides mechanical retention against cable strain or vibration.
The mating pitch is 0.050 inches (1.27 mm), with the same 0.050-inch row spacing, making it a fine-pitch connector for dense PCB routing.
Yes, it is ROHS3 compliant.