100 positions at 1.27 mm pitch — dense signal routing
The 6-104693-0 is a 100-position, 2-row header from TE's AMPMODU 50/50 Grid series, on 1.27 mm pitch — the tightest standard header pitch, which sets the board footprint and limits per-contact current to 0.5 A. This is a pure signal interconnect; don't plan on pushing power through it. The 4-wall shrouded housing protects the 0.120-inch (3.05 mm) mating pins during handling and guides the mating receptacle, reducing bent-pin risk in blind-mate assemblies.
Gold mating finish and board lock for reliable SMT assembly
The tin-plated solder tails (150 µinch) are standard for SMT reflow.
Board-to-board mezzanine fit — 9.91 mm stack height
Mated stack height is 9.91 mm — a standard mezzanine gap for mid-range board spacing. In high-vibration environments, consider a locking receptacle or additional board support.