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TE Connectivity AMP Connectors 6-104894-0 — Pin Headers, Sockets & Housings

TE AMPMODU 50/50 Grid 6-104894-0 Header, 100-Pos 1.27mm

MPN6-104894-0
Active

TE Connectivity AMPMODU 50/50 Grid header, order code 6-104894-0, 100 positions, dual row, 0.050" (1.27 mm) pitch, 0.5 A per contact, gold-plated mating contacts, surface-mount right-angle, solder termination, shrouded 4-wall.

$13.0000Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Aug 2026

Specifications

6-104894-0 key specifications
ParameterValue
SeriesAMPMODU 50/50 Grid
TypeMale Pin
MountingSurface Mount, Right Angle
Connector typeHeader
Fastening typePush-Pull
Current rating0.5A per Contact
Operating temperature-65°C ~ 105°C
Contact materialBrass
Insulation colorBlack
Insulation height0.213\" (5.40mm)
Insulation materialLiquid Crystal Polymer (LCP)
Material flammability ratingUL94 V-0

All specifications

6-104894-0 additional specifications
ParameterValue
StyleBoard to Board
PackageTube
FeaturesBoard Lock, Solder Retention
ShroudingShrouded - 4 Wall
TerminationSolder
ApplicationsAutomotive, General Purpose, Medical, Military, Telecommunications
Contact shapeCircular
Rows2
Pitch0.050\" (1.27mm)
Positions100
Row spacing - mating0.050\" (1.27mm)
Contact finish - postTin
Contact finish - matingGold
Contact finish thickness - post150.0µin (3.81µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

100-position 1.27 mm board-to-board header

The 6-104894-0 is the 100-circuit member of TE's AMPMODU 50/50 Grid header line, a board-to-board interconnect on 0.050" (1.27 mm) pitch with a dual-row layout.

Position count and footprint across the series

The 6-104894-0 carries 100 positions loaded all, with a 0.050" (1.27 mm) row-to-row spacing matching the mating pitch — the footprint and board lock layout are shared across the AMPMODU 50/50 Grid series, so the position count alone selects the circuit density.