24-circuit breakaway header on a 0.100-inch grid
The 6-146256-2: This is a TE Connectivity AMPMODU Mod II unshrouded breakaway header, 24 positions in two rows on the standard 0.100-inch (2.54 mm) pitch. The 0.100-inch row spacing matches legacy wire-wrapping and IDC ribbon-cable footprints — the board layout is the same as a standard DIP socket pattern. The through-hole solder tails are tin-plated 100 µinch, 0.120-inch long — they fit a 0.040-inch plated-through hole on a typical 0.062-inch board.
Gold mating face for moderate reconnect duty
In a test-equipment or programming fixture where the header sees a few dozen matings per year, that gold layer will outlast the product. The tin-plated solder tails are a separate interface: tin-to-tin on the board side, no gold waste on the barrel.
Board-to-board or cable use, no shroud
Listed as Board to Board or Cable style. This is the same form factor as a BergStik or other square-pin strip; it mates with any 0.025-inch square-post receptacle on 0.100-inch centers.
RoHS compliant. No official second-source cross-reference from TE, but the 0.100-inch pitch and dual-row layout are a commodity footprint — functionally equivalent headers from other manufacturers exist, though the breakaway feature and gold thickness may differ.