Board-to-Board Mezzanine Interconnect for High-Density Routing
The 0.031" (0.80mm) pitch packs 200 circuits into a compact footprint — the tightest pitch in the FH family, which means the board designer needs to route traces and vias within a narrow keep-out zone. This is the receptacle side of the connection, with outer shroud contacts that accept the mating plug. A board guide feature on the housing aligns the connector pair during assembly, taking shear stress off the signal pins and preventing bent contacts in high-density layouts.
Both halves are surface-mount (SMT), so the assembly goes through reflow together. The board guide on the receptacle aligns the pair before the contacts engage, which is useful when populating both boards in a pick-and-place line.