The 0.535" (13.59mm) height above board gives a tall stack for a fine-pitch mezzanine, so the z-height budget in the enclosure needs to accommodate that standoff.
Board Layout and Routing at 0.60 mm Pitch
At this spacing, trace widths and via keep-outs need to be planned to avoid crosstalk and maintain manufacturability. The 80 positions in two rows mean 40 per row, so the footprint spans roughly 24 mm along the board edge — a dense interconnect that saves real estate but demands careful fan-out.
The contacts are finished with 11.8µin (0.30µm) of gold over the mating area. It is not a heavy-duty field-service grade; if the application calls for frequent reconnections or exposure to corrosive atmospheres, a thicker gold (like the 50.0µin on the 1-120532-2 sibling) would be more appropriate.