Board-to-wire header for 0.250" pitch harnesses
Its 0.250" (6.35mm) pitch sets the board footprint and the per-contact current ceiling — at the typical 5 A rating for this series, the temperature rise stays within the polyamide housing limit. Tin-plated mating and post finish suits moderate-cycle applications in clean, dry environments. The integral mounting flange adds mechanical stability beyond the solder tails.
Sizing the footprint and routing density
At 0.250" (6.35mm) pitch, the 8-position header occupies roughly 1.75" of board edge. The 0.160" (4.06mm) post length provides adequate solder-joint standoff for wave-solder processes. The 0.360" (9.14mm) insulation height leaves clearance for mating housing latches and wire-dress above the board. Single-row layout keeps the board keep-out narrow — useful for tight panel-mount headers where the connector sits near the enclosure wall.