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TE Connectivity AMP Connectors 643464-4 — Pin Headers

643464-4 TE Connectivity MTA-156 Header, 7 Pos, 0.156" Pitch

MPN643464-4
Active

TE Connectivity AMP Connectors MTA-156, Board to Cable/Wire Header, 7 positions (6 loaded), 0.156" (3.96mm) pitch, shrouded 1 wall, friction lock, through hole solder, tin contacts, UL94 V-0.

$0.5800Ref. price · indicative, final on quote
RoHSRoHS Compliant
SeriesMTA-156
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

643464-4 key specifications
ParameterValue
SeriesMTA-156
TypeMale Pin
MountingThrough Hole
Connector typeHeader
Fastening typeFriction Lock
Voltage rating600VAC
Current ratingVaries by Wire Gauge
Operating temperature-55°C ~ 105°C
Contact materialCopper Alloy
Insulation colorNatural
Insulation height0.425\" (10.80mm)
Insulation materialThermoplastic, Glass Filled

All specifications

643464-4 additional specifications
ParameterValue
Material flammability ratingUL94 V-0
StyleBoard to Cable/Wire
PackageBulk
ShroudingShrouded - 1 Wall
TerminationSolder
ApplicationsGeneral Purpose, Industrial
Contact shapeSquare
Rows1
Pitch0.156\" (3.96mm)
Positions7
Contact finish - postTin
Contact length - post0.125\" (3.18mm)
Overall contact length0.650\" (16.51mm)
Contact finish - matingTin
Contact length - mating0.400\" (10.16mm)

Product details

MTA-156 Header for Wire-to-Board Harnesses

The 0.156" (3.96mm) pitch matches the MTA-156 receptacle family, making it a direct mate for IDC or crimp-socket housings in harness builds. The single-wall shrouding guides the plug and protects the pins during blind mating.

Through-Hole Solder with Tin Contacts

The tin-on-tin contact interface (mating and post) is rated for general-purpose and industrial environments where moderate mating cycles are expected.

Frequently asked questions

What is the pitch of 643464-4?

The mating pitch is 0.156" (3.96mm), standard for the MTA-156 series. The single row of 7 positions (6 loaded) fits the matching receptacle footprint.